Grooves formed around a semiconductor device on a circuit board



FIG. 1 is a plan view of a first embodiment of the grooves formed around a semiconductor device on a circuit board showing our new design;

FIG. 2 is an enlarged view of the area boxed by the dash-dot-dash line in FIG. 1;

FIG. 3 is a sectional view taken along line 3—3 in FIG. 2;

FIG. 4 is a sectional view taken along line 4—4 in FIG. 2;

FIG. 5 is a plan view of a second embodiment;

FIG. 6 is an enlarged view of the area boxed by the dash-dot-dash line in FIG. 5;

FIG. 7 is a sectional view taken along line 7—7 in FIG. 6;

FIG. 8 is a sectional view taken along line 8—8 in FIG. 6;

FIG. 9 is a plan view of a third embodiment;

FIG. 10 is an enlarged view of the area boxed by the dash-dot-dash line in FIG. 9;

FIG. 11 is a sectional view taken along line 11—11 in FIG. 10; and,

FIG. 12 is a sectional view taken along line 12—12 in FIG. 10.

The broken lines represent unclaimed subject matter. 

The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described. 